Universal-H300 is a 12-inch CMP equipment developed by Hwatsing to meet the leading-edge demands of the industry. It integrates advanced polishing technology, high efficiency and high stability. This equipment adopts an innovative polishing system architecture, which can significantly enhance polishing efficiency. It is equipped with more advanced cleaning technology to meet the increasingly demanding cleanliness requirements. It can better achieve global planarization of wafers at the nanometer level, meeting the needs of advanced process technologies. It has been widely applied in manufacturing processes such as integrated circuits, advanced packaging, and large silicon wafers.