The Universal-TGS200 is a chemical mechanical polishing system specifically engineered for third-generation semiconductor materials (SiC). It is equipped with three polishing modules based on a single-platen double-head design, and integrates post-cleaning modules, enabling double-sided wafer polishing. It features a high level of automation and high processing efficiency. It is suitable for the fabrication of silicon carbide (SiC) substrates, the verification of the performance of polishing consumables, the development of advanced CMP process, and other fields of third-generation semiconductor materials.