Master-BN300 is a 12 inch wafer bevel precision polishing equipment developed based on cutting-edge industry requirements. This device integrates high-precision polishing, efficient cleaning, and precise measurement functions, adopts modular design, and is compatible with the needs of various processes and application fields. It can significantly improve the smoothness of wafer bevel, meet the technical requirements for high-precision bevel processing in the semiconductor manufacturing field, and has been applied in key processes such as storage chips and advanced packaging.