HSC-F2400 is applied to final cleaning of 4/6/8-inch compound semiconductor materials respectively. The equipment is based on the innovative technology of Hwatsing's independent intellectual property rights, equipped with superior performance single cleaner module and double-sided brushing module, integrating a variety of chemical liquids, and equipped with advanced physical cleaning methods to show more excellent cleaning effect. The equipment meets the needs of a wide range of compound semiconductor materials and has been applied in bulk in the compound semiconductor field.