Hwatsing has a standard wafer reclaim production workshop and a professional CMP/Wet cleaning technology team, which can provide comprehensive technical support, sales, and OEM services according to various process requirements of customers.
Lower Thickness remove: Using CMP for grinding, compared to traditional reclaim, the lower Thickness remove can greatly reduce costs for FAB
180K pcs/month shipment: Establish a complete set of advanced FAB factory which Cu/Non-Cu 100% physically isolated wafer reclaim process, with a shipment volume of 180K pcs/month
26nm particle control: The complete online MES system production process control ，with its 26nm particle control technology leading the industry level